The electronic components have been ruling the world since few decades. Heat dissipation in the electronic components is being a critical issue with the development of chip integrated circuits. Gradual decrease in size of the components has resulted in drastic increase of the amount of heat generation per unit volume. In the present work a copper water block is used as heat sink having overall dimension 38×38×2.5 mm. Pure water is used as cooling fluid. The surface temperature of the aluminum block is tested for 25 W, 54 W and 100 W at different flow rates of water. The temperature of the heated aluminium block is observed at different flow rates of water at each input. It is observed that the convection heat transfer coefficient of water flowing through the copper tubes is increased with increasing the flow rate. The results were analyzed through Response Surface Methodology by Mini Tab software. It is observed that the percentage error is less than 0.5. From Optimization plot it is observed that when the heat input is 25 W minimum surface temperature 30.9976°C occurs when the flow rate is 2.7 l/min.
Convection heat transfer coefficient, Electronics cooling, Heat sink, Heated Aluminium block, Response surface method
