The electronic components have been ruling the world since few decades. Heat dissipation in the electronic components is being a critical issue with the development of chip integrated circuits. Gradual decrease in size of the components has resulted in drastic increase of the amount of heat generation per unit volume. In the present work copper tubes brazed on a copper plate is used as heat sink having overall dimension 38×38×2.5mm. Diluted Ethylene glycol at volume fraction of 40% and pure water are used as cooling fluids. The surface temperature of the heated aluminum block is tested at different flow rates of water and diluted ethylene glycol. The temperature of the block is maintained below 45°c when water is used. The convection heat transfer coefficient of water flowing through the copper tubes is increased with increasing the flow rate is observed. Pump power is calculated at each flow rate of water and Ethylene glycol. In the present work
Electronics cooling, Diluted Ethylene glycol, pump power
