1Part Time Research Scholar, Department of Chemistry, Manonmanium Sundaranar University, Tirunelveli, Tamilnadu, India.
2Part Time Off Campus Scholar, Dravidian University, Kuppam, Andhra Pradesh, India.
3Department of Chemistry, DKM College for Women, Vellore, Tamilnadu, India
*Email: parsu8@yahoo.com
Online published on 11 December, 2012.
The presence of toxic heavy metals in electroplating industrial effluent is a pervasive and serious pollution problem. The ability of chitin binary blend as an adsorbent for Cu and Ni ions in aqueous solution was studied. Chitin was blended with poly(vinyl alcohol) in the presence of formaldehyde as a cross linking agent. Removal of Cu and Ni has been found to be pH, contact time and adsorbent dosage dependent. Adsorption isotherm studies indicated that the adsorptive behavior of metal ions on chitin/PYA binary blend satisfies Freundlich assumptions and follows pseudo second order kinetic model. Results show that the chitin/PVA binary blend is a good adsorbent for the removal of copper and nickel ions from metal solution.
Chitin, poly (vinyl alcohol), formaldehyde, binary blend, effluent