1Semiconductor Device Research Laboratory, Department of Electronic Science, University of Delhi, South Campus, New Delhi-110 021
2Department of Electronic Science, A.R.S.D. College, University of Delhi South Campus, New Delhi-110 021
3Department of Electronics and Communication Engineering, Maharaja Agrasen Institute of Technology, Sector-22, Rohini, New Delhi-110 086
*E-mail: mridula@south.du.ac.in
Online published on 5 August, 2015.
The paper focuses on the significance of optimization of the various device parameters for achieving improved RF and noise performance. A charge control based analytical model is employed for the evaluation of various performance parameters of InAlAs/InGaAs double-gate (DG-) HEMT. While, shortening of gatelength leads to significant improvement in the device performance in terms of lower Minimum Noise Figure (NFmin) and higher Maximum Frequency of Oscillation (fmax), reduction in the donor-layer thickness leads to lower fmax. In addition to this, increase in the donor-layer doping which accompanies reduction in gatelength and donor-layer thickness leads to lower fmax and higher NFmin. Therefore, optimisation of various device parameters is essential for achieving improved RF and noise performance without letting the short channel effects become dominant.
InAlAs/InGaAs, double-gate, HEMT, maximum frequency of oscillation, minimum noise figure